Scaling AI accelerators only happens with extreme density and high-speed performance interconnects. Samtec’s Si-Fly® HD co-packaged interconnect systems provide the highest density 224 Gbps PAM4 solution in today's market. Electrically pluggable co-packaged copper and optics solutions (known as CPX) adjacent to AI accelerators are achievable on a 95 mm x 95 mm or smaller substrates. This proximity eliminates long PCB traces, greatly reducing loss while preserving serviceability in a pluggable form factor.
In the Demo Stage presentation, Samtec technical experts will summarize real-world performance data of CPX implementations in various 224 Gbps PAM4 signal channels typically found in AI acceleration platforms. Additionally, an preview of AI scale-up and scale-out networks using CPX technologies will also be presented.
Matthew Burns
Matthew Burns develops go-to-market strategies for Samtec’s Silicon-to-Silicon solutions. Over the course of 25 years, he has been a leader in design, applications engineering, technical sales and marketing in the telecommunications, medical and electronic components industries. He currently serves as Secretary at PICMG. Mr. Burns holds a B.S. in Electrical Engineering from Penn State University.